{"title":"互联网状电力系统(IMPS)的封装与互联应用","authors":"C. V. Reynolds, L. Schaper","doi":"10.1109/ICMCM.1994.753549","DOIUrl":null,"url":null,"abstract":"High volume applications of complex MCMs are slow to enter commercial production. There are two major interrelated technological barriers, namely the availability of reliable and cost and performance effective known good interconnection substrates and the commercial availability of known good die (KGD). This paper reports on an application of the, Interconnected Mesh Power System (IMPS) *[1] interconnect topology in an MCM-L based design to achieve the same interconnect and electrical functionality as that accomplished with four layers. This was accomplished using the two layer topology with a third layer dedicated to mounting the caps.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Interconnected Mesh Power System, (IMPS) A Packaging and Interconnection Application\",\"authors\":\"C. V. Reynolds, L. Schaper\",\"doi\":\"10.1109/ICMCM.1994.753549\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High volume applications of complex MCMs are slow to enter commercial production. There are two major interrelated technological barriers, namely the availability of reliable and cost and performance effective known good interconnection substrates and the commercial availability of known good die (KGD). This paper reports on an application of the, Interconnected Mesh Power System (IMPS) *[1] interconnect topology in an MCM-L based design to achieve the same interconnect and electrical functionality as that accomplished with four layers. This was accomplished using the two layer topology with a third layer dedicated to mounting the caps.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753549\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753549","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnected Mesh Power System, (IMPS) A Packaging and Interconnection Application
High volume applications of complex MCMs are slow to enter commercial production. There are two major interrelated technological barriers, namely the availability of reliable and cost and performance effective known good interconnection substrates and the commercial availability of known good die (KGD). This paper reports on an application of the, Interconnected Mesh Power System (IMPS) *[1] interconnect topology in an MCM-L based design to achieve the same interconnect and electrical functionality as that accomplished with four layers. This was accomplished using the two layer topology with a third layer dedicated to mounting the caps.
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