{"title":"锡膏干燥对可焊性的影响","authors":"A. Otáhal, M. Adamek, I. Szendiuch","doi":"10.1109/ISSE.2014.6887592","DOIUrl":null,"url":null,"abstract":"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"416 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Impact of solder paste drying on the solderability\",\"authors\":\"A. Otáhal, M. Adamek, I. Szendiuch\",\"doi\":\"10.1109/ISSE.2014.6887592\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.\",\"PeriodicalId\":375711,\"journal\":{\"name\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"volume\":\"416 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2014.6887592\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887592","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of solder paste drying on the solderability
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
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