多gbps I/O通道余量改进中交错微带主板路由的实现

Y. J. Tan, H. Heck, J. Kong, W. Tan
{"title":"多gbps I/O通道余量改进中交错微带主板路由的实现","authors":"Y. J. Tan, H. Heck, J. Kong, W. Tan","doi":"10.1109/EPEPS.2012.6457901","DOIUrl":null,"url":null,"abstract":"This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent improvement in topologies with longer transmission lines. This method enables greater routing flexibility using full microstrip transmission lines with the benefit of improved channel margins at 20 mils inter-pair spacing. More importantly, it allows for the more tightly spaced 15 mils interpair spacing to be utilized without jeopardizing overall channel margins. Ultimately, this translates into a cost saving benefit in line with recent platforms' sleek and thin form factor.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"82 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An implementation of interleaved microstrip motherboard routing in Multi-Gbps I/O channel margin improvement\",\"authors\":\"Y. J. Tan, H. Heck, J. Kong, W. Tan\",\"doi\":\"10.1109/EPEPS.2012.6457901\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent improvement in topologies with longer transmission lines. This method enables greater routing flexibility using full microstrip transmission lines with the benefit of improved channel margins at 20 mils inter-pair spacing. More importantly, it allows for the more tightly spaced 15 mils interpair spacing to be utilized without jeopardizing overall channel margins. Ultimately, this translates into a cost saving benefit in line with recent platforms' sleek and thin form factor.\",\"PeriodicalId\":188377,\"journal\":{\"name\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"82 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2012.6457901\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457901","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

提出了一种多gbps接口下主板微带路由的交错路由方法。该方法在眼高(mV)和眼宽(ps)边缘方面提高了信道性能。值得注意的是更长的传输线拓扑结构的显著改进。这种方法可以使用全微带传输线实现更大的路由灵活性,并在对间间距为20密耳的情况下改善通道裕度。更重要的是,它允许更紧密的间隔15密耳的互连间距被利用,而不会危及整个通道的边界。最终,这将转化为节省成本的优势,符合最近平台的光滑和薄的外形因素。
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An implementation of interleaved microstrip motherboard routing in Multi-Gbps I/O channel margin improvement
This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent improvement in topologies with longer transmission lines. This method enables greater routing flexibility using full microstrip transmission lines with the benefit of improved channel margins at 20 mils inter-pair spacing. More importantly, it allows for the more tightly spaced 15 mils interpair spacing to be utilized without jeopardizing overall channel margins. Ultimately, this translates into a cost saving benefit in line with recent platforms' sleek and thin form factor.
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