R. Kandasamy, Pengfei Liu, H. Feng, T. Wong, K. Toh
{"title":"电介质液体喷雾冷却强化研究","authors":"R. Kandasamy, Pengfei Liu, H. Feng, T. Wong, K. Toh","doi":"10.1109/EPTC.2018.8654446","DOIUrl":null,"url":null,"abstract":"An experimental investigation on closed-loop single nozzle spray cooling with and without the presence of non-condensable gas in the system was carried out. A circular bare copper heated surface of area 3.14 cm2 was spray cooled with dielectric liquid PF-5060 and FC-3284 in this study. Results showed that spray cooling without non-condensable gas showed a lower surface temperature for the same heat flux compared to that with non-condensable gas.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"244 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Spray cooling enhancement studies using dielectric liquid\",\"authors\":\"R. Kandasamy, Pengfei Liu, H. Feng, T. Wong, K. Toh\",\"doi\":\"10.1109/EPTC.2018.8654446\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An experimental investigation on closed-loop single nozzle spray cooling with and without the presence of non-condensable gas in the system was carried out. A circular bare copper heated surface of area 3.14 cm2 was spray cooled with dielectric liquid PF-5060 and FC-3284 in this study. Results showed that spray cooling without non-condensable gas showed a lower surface temperature for the same heat flux compared to that with non-condensable gas.\",\"PeriodicalId\":360239,\"journal\":{\"name\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"244 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2018.8654446\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654446","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Spray cooling enhancement studies using dielectric liquid
An experimental investigation on closed-loop single nozzle spray cooling with and without the presence of non-condensable gas in the system was carried out. A circular bare copper heated surface of area 3.14 cm2 was spray cooled with dielectric liquid PF-5060 and FC-3284 in this study. Results showed that spray cooling without non-condensable gas showed a lower surface temperature for the same heat flux compared to that with non-condensable gas.