单片三维技术中的跨功率域接口电路设计

Jing Xie, Yang Du, Yuan Xie
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引用次数: 1

摘要

优化电子系统的能耗一直是一个重要的设计焦点。多功率域设计广泛应用于低功耗和高性能应用。电源域之间的数据传输需要一个跨电源域接口(CPDI)。现有的电平转换触发器(LCFF)结构都需要双电源轨,这导致了较大的面积和性能开销。在本文中,我们提出了一种利用单片三维技术的CPDI电路。该接口的功能类似于触发器,提供从一个电源域到另一个电源域的可靠数据转换。我们的设计将每层的电源轨道分开,大大降低了物理设计的复杂性和面积损失。该设计采用45纳米低功耗技术实现。与现有的LCFF设计相比,它的Q值减小了20%-35%,节能30%。在电压变化为±10%时,该设计具有较好的鲁棒性。
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CPDI: Cross-power-domain interface circuit design in monolithic 3D technology
Optimizing energy consumption for electronic systems has been an important design focus. Multi-power domain design is widely used for low power and high performance applications. Data transfer between power domains needs a cross power domain interface (CPDI). The existing level-conversion flip-flop (LCFF) structures all need dual power rails, which leads to large area and performance overhead. In this paper, we propose a CPDI circuit utilizing monolithic 3D technology. This interface functions as a flip-flop and provides reliable data conversion from one power domain to another. Our design separates power rails in each tier, substantially reducing physical design complexity and area penalty. The design is implemented in a 45nm low power technology. It shows 20%-35% smaller clock to Q and 30% energy saving comparing with existing LCFF designs. The proposed design also shows better robustness with ±10% voltage variation.
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