使用110纳米CMOS技术的产品相关总线系统中的串扰

M.F. Ktata, H. Grabinski, U. Arz, H. Fischer
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引用次数: 4

摘要

m . F. Ktata等人(2003)研究了在接地基板存在的情况下,地线位置对时域信号形状的影响,其电导率分别为10 S/m(低)和100 S/m(中)。结果表明,衬底效应对时域信号的影响取决于衬底电导率、地线相对于信号线的相对位置以及线路系统的长度。此外,还研究了紧密间隔的信号线之间与工艺相关的产生的空隙对串扰的影响。
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Crosstalk in product related bus systems using 110 nm CMOS technology
The influence of the ground line position on the signal shape in the time domain is investigated in the presence of grounded substrates by M. F. Ktata et al. (2003) with different conductivities of 10 S/m (low) and 100 S/m (medium). It is shown that the impact of substrate effects on time domain signals depends on the substrate conductivity, on the relative position of the ground line with respect to the signal lines as well as on the length of the line system. In addition, the impact of process-related generated voids between closely spaced signal lines on crosstalk is investigated, too.
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Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters Sensitivity analysis of generic on-chip /spl Delta/I-noise simulation methodology A frequency domain approach for efficient model reduction of mixed VLSI circuits Non-uniform grid (NG) algorithm for fast capacitance extraction Dampening high frequency noise in high performance microprocessor packaging
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