N. Nguyen, J. Ibbetson, J. Yen, M. Hashemi, Utkarsh Mishra
{"title":"封装GaAs功率MESFET","authors":"N. Nguyen, J. Ibbetson, J. Yen, M. Hashemi, Utkarsh Mishra","doi":"10.1109/CORNEL.1993.303128","DOIUrl":null,"url":null,"abstract":"Utilizing a combination of low-temperature-grown Al/sub 0.3/Ga/sub 0.7/As passivation, overlapping gate, MOCVD regrowth of the source/drain contacts, and isolation by boron ion implantation, we have fabricated a GaAs MESFET with a completely encapsulated channel. Electrical characterization of the device shows that the early catastrophic on-state breakdown is suppressed. In contrast to the usually observed characteristics in GaAs MESFET, the breakdown locus of the device also has a positive slope. These improvements should allow us to bias the device at a higher operating point, thereby increasing the obtainable maximum output power in the device.<<ETX>>","PeriodicalId":129440,"journal":{"name":"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Encapsulated GaAs power MESFET\",\"authors\":\"N. Nguyen, J. Ibbetson, J. Yen, M. Hashemi, Utkarsh Mishra\",\"doi\":\"10.1109/CORNEL.1993.303128\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Utilizing a combination of low-temperature-grown Al/sub 0.3/Ga/sub 0.7/As passivation, overlapping gate, MOCVD regrowth of the source/drain contacts, and isolation by boron ion implantation, we have fabricated a GaAs MESFET with a completely encapsulated channel. Electrical characterization of the device shows that the early catastrophic on-state breakdown is suppressed. In contrast to the usually observed characteristics in GaAs MESFET, the breakdown locus of the device also has a positive slope. These improvements should allow us to bias the device at a higher operating point, thereby increasing the obtainable maximum output power in the device.<<ETX>>\",\"PeriodicalId\":129440,\"journal\":{\"name\":\"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-08-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CORNEL.1993.303128\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CORNEL.1993.303128","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Utilizing a combination of low-temperature-grown Al/sub 0.3/Ga/sub 0.7/As passivation, overlapping gate, MOCVD regrowth of the source/drain contacts, and isolation by boron ion implantation, we have fabricated a GaAs MESFET with a completely encapsulated channel. Electrical characterization of the device shows that the early catastrophic on-state breakdown is suppressed. In contrast to the usually observed characteristics in GaAs MESFET, the breakdown locus of the device also has a positive slope. These improvements should allow us to bias the device at a higher operating point, thereby increasing the obtainable maximum output power in the device.<>
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