MEMS中有源半导体器件的仿真方法

Mike Schwarz, V. Senz, A. Dannenberg, W. Feiler, F. Heuck, T. Friedrich, C. Sorger, J. Franz
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引用次数: 4

摘要

如今,对MEMS开发/设计套件(MDK)的需求比以往任何时候都更加受关注。为了在汽车和消费应用中实现高质量和高成本效益,需要MEMS(微机电系统)元件的先进设计流程来满足这些标准。本文提出了一种方法和设计流程,以确保有源半导体器件和组件集成到微机械传感器中。该方法考虑了电有源器件和机械MEMS的交叉耦合效应和局限性。最后给出了一个具有机械约束的实例,并将仿真方法的结果与制造装置在设计流程的精度和能力方面进行了比较。
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Simulation Methodology for Active Semiconductor Devices in MEMS
Nowadays, the demand for a MEMS Development/Design Kit (MDK) is even more in the focus than ever. In order to achieve a high quality and cost effectiveness in automotive and consumer applications, an advanced design flow for the MEMS (Micro Electro Mechanical Systems) element is required to fulfill these criteria. In this paper, a methodology and design flow is presented to ensure an integration of active semiconductor devices and components into micromechanical sensors. The methodology considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example with mechanical constraints is presented and discussed and finally the results of the simulation methodology are compared with fabricated devices in terms of accuracy and capability of the design flow.
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