阳极键合:加工MEMS和CMOS晶圆的低温键合方法

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598393

R. Knechtel, H. Mehner, T. Berthold, C. Van Buggenhout, Dirk Terryn

{"title":"阳极键合:加工MEMS和CMOS晶圆的低温键合方法","authors":"R. Knechtel, H. Mehner, T. Berthold, C. Van Buggenhout, Dirk Terryn","doi":"10.1109/LTB-3D53950.2021.9598393","DOIUrl":null,"url":null,"abstract":"Anodic bonding is in general a very attractive low temperature bonding method. Utilizing the progress in glass structuring and with adapted bonding conditions it can be used for CMOS-MEMS integrated wafers enabaling very complex, multifunctional chip solutions.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Anodic Bonding a Low Temperature Bonding Method for Processed MEMS and CMOS Wafers\",\"authors\":\"R. Knechtel, H. Mehner, T. Berthold, C. Van Buggenhout, Dirk Terryn\",\"doi\":\"10.1109/LTB-3D53950.2021.9598393\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Anodic bonding is in general a very attractive low temperature bonding method. Utilizing the progress in glass structuring and with adapted bonding conditions it can be used for CMOS-MEMS integrated wafers enabaling very complex, multifunctional chip solutions.\",\"PeriodicalId\":198318,\"journal\":{\"name\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D53950.2021.9598393\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598393","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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摘要

阳极键合通常是一种非常有吸引力的低温键合方法。利用玻璃结构的进步和适应的键合条件，它可以用于CMOS-MEMS集成晶圆，实现非常复杂的多功能芯片解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Anodic Bonding a Low Temperature Bonding Method for Processed MEMS and CMOS Wafers

Anodic bonding is in general a very attractive low temperature bonding method. Utilizing the progress in glass structuring and with adapted bonding conditions it can be used for CMOS-MEMS integrated wafers enabaling very complex, multifunctional chip solutions.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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