从系统预算到系统实现——一个22nm FDSOI 5G毫米波前端模块(FEM)的视角

Manshu Bishnoi, R. Bhattacharya, V. Aggarwal, T. Kukal, Jonathan Smith, S. Aniruddhan
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引用次数: 0

摘要

提出了一种全面的自顶向下的系统设计方法,并支持了针对24GHz-29GHz 5G移动应用的前端模块(FEM)设计。在设计早期采用封装和PCB地板规划以及热挑战的同时,报告了在系统模拟器中对FEM进行的链路预算分析,然后在GlobalFoundries的22nm FDSOI工艺中实现,重点关注解决系统约束的新架构。FEM显示了仿真与测量之间的良好相关性,并通过将实际5G信号应用于实时测量模拟仿真环境中进一步表征。还描述了集成电路和封装系统协同设计和分析的统一环境。
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System Budgeting to System Realisation - A 22nm FDSOI 5G mmWave Front-End Module (FEM) Perspective
A comprehensive top-down system design methodology is presented and supported with a design of a Front-End Module (FEM) for 5G mobile applications targeting 24GHz-29GHz. While adopting package and PCB floor-planning and thermal challenges early in the design, a link budget analysis of a FEM in a system simulator followed by an implementation in GlobalFoundries' 22nm FDSOI process is reported with a focus on novel architectures to address system constraints. The FEM shows an excellent correlation between simulations and measurements and is further characterized post silicon by applying actual 5G signals in a real-time measurement mimicked simulation environment. A unified environment for co-designing and analysing the IC and package system is also described.
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