含SnAgBiIn合金无铅锡膏的初步研究

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290884

Y. Liu, X.B. Wang

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引用次数: 2

摘要

本文对几种含Sn88Ag3.5Bi0.5In8合金的无铅锡膏进行了初步研究。研究了这些焊膏在不同回流工况下在不同衬底上的润湿性能。锡球、坍落度和印刷性能的测试结果表明，在合适的助焊剂载体下，Sn88Ag3.5Bi0.5In8合金的无铅锡膏可以获得良好的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Lead free solder paste containing SnAgBiIn alloy: a preliminary study

In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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