F. Ganji, Domenic Forte, N. Asadizanjani, M. Tehranipoor, Damon Woodward
{"title":"IC逆向工程对硬件信任和保证的作用","authors":"F. Ganji, Domenic Forte, N. Asadizanjani, M. Tehranipoor, Damon Woodward","doi":"10.31399/asm.edfa.2019-2.p030","DOIUrl":null,"url":null,"abstract":"\n Integrated circuits embedded in everyday devices face an increased risk of tampering and intrusion. In this article, the authors explain how reverse engineering techniques, including automated image analysis, can be employed to provide trust and assurance when dealing with commercial off-the-shelf chips.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The Power of IC Reverse Engineering for Hardware Trust and Assurance\",\"authors\":\"F. Ganji, Domenic Forte, N. Asadizanjani, M. Tehranipoor, Damon Woodward\",\"doi\":\"10.31399/asm.edfa.2019-2.p030\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Integrated circuits embedded in everyday devices face an increased risk of tampering and intrusion. In this article, the authors explain how reverse engineering techniques, including automated image analysis, can be employed to provide trust and assurance when dealing with commercial off-the-shelf chips.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2019-2.p030\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2019-2.p030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Power of IC Reverse Engineering for Hardware Trust and Assurance
Integrated circuits embedded in everyday devices face an increased risk of tampering and intrusion. In this article, the authors explain how reverse engineering techniques, including automated image analysis, can be employed to provide trust and assurance when dealing with commercial off-the-shelf chips.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
