用于异构集成的MEMS器件的无磁倒装芯片互连

T. Lee
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引用次数: 0

摘要

倒装芯片技术(FC)是MEMS器件异构集成的使能技术。FC减小了封装尺寸,提高了性能,并通过3-D封装实现了MEMS芯片的扩展。本文概述了MEMS的FC技术,并指出了MEMS封装的互连挑战。本文分享了一种创新的无焊剂FC键合技术,即用于MEMS封装的固液压缩互扩散技术(SLICF)。瞬时SLICF键合利用机械力打破氧化锡层,并允许淹没体与新鲜熔融焊料相互作用,通过固液互扩散形成键合。这消除了对通量的需求,是MEMS封装异构集成的理想选择。JIV将熔融焊料插入柔性基板上,从而实现MEMS集成的无熔点FC键合。柔性基板的细间距设计原则和可折叠性使其易于异构集成。该键合架构可实现MEMS器件异构集成的无通量FC键合,从而降低封装成本并为异构集成提供高吞吐量。
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Fluxless Flip Chip Interconnects for MEMS Devices for Heterogeneous Integration
Flip chip technologies (FC) is an enabling technology for heterogeneous integration of MEMS devices. FC reduces the package dimension, improves performance as well as enable scaling up of MEMS chips through 3-D packaging. This paper provide an overview of FC technologies for MEMS and identify the interconnect challenges for MEMS packaging. The paper shares an innovative fluxless FC bonding technique known as solid liquid interdiffusion by compressive force (SLICF) for MEMS packaging.The instantaneous SLICF bonding utilizes a mechanical force to break the Sn oxide layer and allows the submerged body to interact with fresh molten solders to form bonds through solid liquid inter-diffusion. This remove the need of flux and ideal for MEMS packaging for heterogeneous integration. The JIV plugged molten solder in via on flex substrate to enable a fluxless FC bonding for MEMS integration. The fine pitch design rule and foldable of flex substrate enable ease of heterogeneous integration. The bonding architecture enable fluxless FC bonding for heterogeneous integration of MEMS devices to reduce packaging cost and provide a high throughput for heterogeneous integration.
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