Development of a Dsp Function Using a Mcm Technology

INTRODUCTION The main electronic activity of MATRA DEFENSE is the development and production of pilot and guidance equipments for air to air missiles. In the mid 80's MATRA DEFENSE qualified a double sided Surface Mount Technology in order to reduce the size and cost of the electronic equipments. This technology is based on polyimide multilayer ( 10 to 14 layers) printed circuit with 2 sheets of Copper / Invar/ Copper. Components are packaged in Leadless Ceramic Chip Carriers and vapor phase is used for the soldering process. In 1990 MATRA DEFENSE started an R&D programme on MCM. We decided not to build the substrate in house, but to concentrate our efforts on the design and the assembly technology for MCM. The two first modules developed were memory modules ( SRAM and EEPROM ) but these modules were nevers build in series because they didn't fit our needs in terms of size and production cost in comparison with the monolithic components. Our first real application was a complex MCM standard module for using in different applications to be produced in "large" series.