Y. Warashina, Tomofumi Suzuki, Kohei Kasamori, Ryosuke Okumura, Yuki Matsuo, M. Takemura
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引用次数: 7
摘要
MEMS-FTIR发动机是傅里叶变换红外光谱仪的关键器件,它由迈克尔逊干涉仪组成,该干涉仪包括控制运动镜的静电致动器、入射光的光纤槽和光电探测器。除了光电探测器外,所有这些元件都是使用MEMS技术在硅上单片制造的。采用深度反应离子蚀刻(Deep Reactive Ion Etching, DRIE)技术,以高精度同时形成分束器、固定反射镜和移动反射镜等光学元件。垂直侧壁被用作光学平面,使得入射光路与硅衬底平行。移动镜由静电MEMS致动器驱动。光电探测器放置于光路末端位置的硅晶体平面通过碱性湿蚀刻形成的角度反射镜上方。通过表面激活键合技术,将包括光电探测器在内的所有元件密封地覆盖在真空室中的硅盖上。为了降低成本,介绍了晶圆级工艺和在所有组装过程后用激光切割机将每个芯片分离。所实现的MEMS-FTIR尺寸为10×17×1 mm,信噪比(SNR)优于35dB,这得益于通过控制DRIE蚀刻条件,垂直侧壁作为光学平面具有小于0.2度的良好垂直度。
MEMS based miniature FT-IR engine with built-in photodetector
A MEMS-FTIR engine has been developed as a key device for the Fourier-Transform Infrared Spectrometer, which consists of a Michelson interferometer including an electro-static actuator to control a moving mirror, an optical fiber groove for incident light and a photodetector. All these elements except for the photodetector are monolithically fabricated in Silicon using MEMS technology. The optical elements such as a beam splitter, a fixed mirror and a moving mirror are formed and aligned simultaneously with high degree of precision by Deep Reactive Ion Etching (DRIE). The vertical side walls are utilized as optical planes so that the incident light path is located in parallel with the Silicon substrate. The moving mirror is driven by an electro-static MEMS actuator. The photodetector is placed above an angled mirror, which is formed by alkaline wet etching exposing the Silicon crystal plane at the end position of light path. All the elements including the photodetector are hermetically covered by a lid of Silicon in the vacuum chamber by using a surface activate bonding technology. In order to reduce the cost, wafer level process and separation of each chip by a laser dicer after all assembly processes are introduced. The realized MEMS-FTIR is 10×17×1 mm in size and a signal noise ratio (SNR) of better than 35dB, which comes from a good verticality of less than 0.2 degree in the vertical side walls as optical planes by managing the DRIE etching conditions.