{"title":"利用模拟网络进行微电子结构的温度评估","authors":"G. Rezek","doi":"10.1109/TPEP.1965.1136696","DOIUrl":null,"url":null,"abstract":"The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Temperature Evaluation in Microelectronics Structures Using Analog Networks\",\"authors\":\"G. Rezek\",\"doi\":\"10.1109/TPEP.1965.1136696\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.\",\"PeriodicalId\":313371,\"journal\":{\"name\":\"IEEE Transactions on Product Engineering and Production\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1965-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Product Engineering and Production\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPEP.1965.1136696\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Product Engineering and Production","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPEP.1965.1136696","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature Evaluation in Microelectronics Structures Using Analog Networks
The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.
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