{"title":"通过多芯片模块设计人员访问服务(MIDAS)灵活访问MCM技术","authors":"J. Peltier, W. Hansford","doi":"10.1109/MCMC.1996.510774","DOIUrl":null,"url":null,"abstract":"The MCM Designers' Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nChip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface \"transparent\" to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Flexible access to MCM technology via the multichip module designers' access service (MIDAS)\",\"authors\":\"J. Peltier, W. Hansford\",\"doi\":\"10.1109/MCMC.1996.510774\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The MCM Designers' Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nChip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface \\\"transparent\\\" to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed.\",\"PeriodicalId\":126969,\"journal\":{\"name\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1996.510774\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Flexible access to MCM technology via the multichip module designers' access service (MIDAS)
The MCM Designers' Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nChip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface "transparent" to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed.