掺杂技术与扩散速率和氧化速率的相关性研究

A. Zoolfakar, H. Zulkefle, A. Zakaria, A. Manut, Abdul Aziz A, M. Zolkapli
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摘要

本文研究了掺杂技术与扩散速率和氧化物生长速率的关系。目前研究的掺杂技术主要有固体源型SS和自旋型SOD两种。以4英寸晶圆为研究对象,研究了掺杂技术对扩散速率和氧化速率的影响。用四点探头测量硅衬底的电阻率,用椭偏仪测量氧化物的厚度。实验结果表明,固体源的扩散速率比旋在Dopand上的扩散速率高86%左右。固体源的氧化物生长比掺杂自旋高3.6%。
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Correlation study between doping technique towards diffusion rate and oxidation rate
This paper is to investigate correlation between doping technique towards diffusion rate and oxide growth rate. There are two types of doping technique that has been investigated such as Solid Source, SS and Spin on Dopant, SOD. Four inches wafers were used to investigate the effects of doping technique towards diffusion rate and oxidation rate. The resistivity of silicon substrate is measured by using 4-point probe while the oxide thickness is measured by an Ellipsometer. From this experiment, it can be concluded that diffusion rate of Solid Source is about 86% better than Spin on Dopand. While the oxide growth of Solid Source, SS is 3.6% better than Spin on Dopant.
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