The Research of Low Temperature Sintering Nano-sliver Paste Based on Anand Model

Considering of the advantages of low temperature sintering of nano-silver paste, compared with other lead-free solders, low temperature sintering of nano-silver paste has been applied in chip packaging. Someone conducted in-depth research on the tensile behavior of nano-silver paste of low temperature sintering and test on the Dynamic Mechanical Analyzer (DMA), some of the sintered sliver films under different temperature decrease with increasing temperature or with decreasing strain rate. In this study, Anand viscoplastic constitutive model was adopted, and ANSYS software was used to simulate the hot cycle load of the chip and the conjunctiva of nano-silver paste. The simulation results show that the plastic strain accumulation occurred in the nano-silver paste bond layer during the temperature cyclic loading process, which is the main reason that may cause the failure of chip connection..