{"title":"基于平衡TLM和通孔耦合模型的通孔信号激发的功率/地平面边缘辐射预测与验证","authors":"J. Pak, Junwoo Lee, Hyungsoo Kim, Joungho Kim","doi":"10.1109/EPEP.2003.1250027","DOIUrl":null,"url":null,"abstract":"We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model\",\"authors\":\"J. Pak, Junwoo Lee, Hyungsoo Kim, Joungho Kim\",\"doi\":\"10.1109/EPEP.2003.1250027\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250027\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model
We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.
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