纳米电子电阻式存储器的容错结构

D. Strukov, K. Likharev
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引用次数: 4

摘要

我们计算了在未来的混合(CMOS/纳米器件)电阻式存储器中,坏位排除和高级(BCH)纠错码的协同作用可能实现的有用密度,作为缺陷存储器单元分数的函数。结果表明,CMOS/纳米节距比接近3的存储器(这在当前混合电路开发的初始阶段是典型的),即使在相当严格的总访问时间(30 ns)限制下,如果不良纳米器件的比例低于~ 15%,则可以在有效位密度上优于具有相同CMOS设计规则的通常电阻和闪存。此外,随着技术的成熟,并且螺距比接近一个数量级,混合电阻存储器可能远远优于最密集的半导体存储器,例如,即使在非常保守的缺陷分数为~ 2%的情况下,也可以提供1 Tbit/cm2的密度。
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A Defect-Tolerant Architecture for Nanoelectronic Resistive Memories
We have calculated the useful density that may be achieved by the synergy of bad bit exclusion and advanced (BCH) error correcting codes in prospective hybrid (CMOS/nanodevice) resistive memories, as a function of the defective memory cell fraction. The results indicate that the memories with a CMOS/nano pitch ratio close to 3 (which is typical for the current, initial stage of hybrid circuit development), may overcome the usual resistive and flash memories with the same CMOS design rules in useful bit density if the fraction of bad nanodevices is below ~ 15%, even under rather tough (30 ns) restrictions on the total access time. Moreover, as the technology matures, and the pitch ratio approaches an order of magnitude, the hybrid resistive memories may be far superior to the densest semiconductor memories by providing, e. g., a 1 Tbit/cm2 density even for a very conservative defect fraction of ~ 2%.
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