三维热感知地板规划中矩形和双信号硅孔插入的可靠性考虑

Chih-han Hsu, S. Ruan, Ying-Jung Chen, Tsang-Chi Kan
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引用次数: 2

摘要

三维集成电路中的垂直集成层加剧了热问题,特别是可靠性下降。低可靠性不仅会损坏整个电路,而且会造成意想不到的性能损失。为了提高可靠性,本文采用矩形stsvs和双stsvs对SA发动机进行了设计。早期的研究表明,芯片的STSVs越多,可靠性越好。然而,它也意味着更大的面积。因此,我们开发了一种方法来操纵热感知平面,并在STSVs数量,可靠性和芯片面积之间进行权衡。此外,我们用精确的热模型来管理我们的操纵平面,以使TTSVs在通过通道插入。实验结果表明,80%以上的单stv可以被矩形stv或双stv所取代,从而提高了可靠性。此外,在插入TTSVs后,温度可以保持在80°C左右,并且TTSVs最小。
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Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning
Vertical integration of layers in a 3D IC exacerbates thermal problem especially for reliability degradation. Low reliability can not only damage the whole circuits but also cause unexpected performance loss. In this paper, we conduct the SA engine with rectangle-STSVs and double-STSVs for improving reliability. The earlier research indicates that the more STSVs a chip has, the better the reliability is. However, it also implies a larger area. Therefore, we develop a methodology to manipulate thermal-aware floorplan with the tradeoff among the number of STSVs, reliability, and area of a chip. Moreover, we manage our manipulated floorplan with precise thermal model for TTSVs insertion at via channel. Experimental results show that more than 80% of single-STSVs can be replaced by rectangle-STSVs or double-STSVs, thereby improving reliability. Furthermore, temperature can be maintained around 80°C with minimal TTSVs after inserting TTSVs.
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