基于MCM-C技术的ATM交换模块

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI:10.1109/ICMCM.1994.753539

M. Yamada, Y. Otsuki, T. Kikuchi, H. Shibuya

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引用次数: 1

摘要

多芯片模块(MCM)技术已被寄予高速和高密度封装的期望。作者利用MCM-C技术和低温共烧陶瓷(LTCC)衬底，开发了时钟速度为622 Mb/s、功耗为60瓦的8 × 8 ATM交换模块。本文将讨论ATM交换模块的MCM封装技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An ATM Switching Module using MCM-C Technology

Multichip module (MCM) technology has been expected for high speed and high density packaging. Authors have developed an 8 x 8 ATM switching module with clock speed of 622 Mb/s and power consumption of 60 watts by using MCM-C technology with low temperature co-fired ceramic (LTCC) substrate. This paper will discuss MCM packaging technologies for an ATM switching module.

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Proceedings of the International Conference on Multichip Modules

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