{"title":"考虑残余应力的电容式MEMS传声器标度分析","authors":"Kui Song, Weiguan Zhang, Wei Xu, Yi-Kuen Lee","doi":"10.1109/NEMS.2016.7758228","DOIUrl":null,"url":null,"abstract":"We conduct a systematic scaling analysis of the sensitivity of a silicon capacitive MEMS microphone based on a dimensionless 1-degree-of-freedom (1DOF) model considering residual stress. The theoretical normalized sensitivity we derived is a nonlinear function of normalized diaphragm size (h/a), acoustic driving frequency, 3 effective stiffness terms and the other parameters. From our 1DOF model, the optimal normalized diaphragm has to be trade-off between high sensitivity and large bandwidth. In addition, we found that a critical diaphragm radius of 415 μm for a silicon MEMS microphone, is located at the inflection point in the sensitivity function of the radius. In addition, this critical radius corresponds to the minimum effective stiffness of the microphone.","PeriodicalId":150449,"journal":{"name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Scaling analysis of capacitive MEMS microphones considering residual stress\",\"authors\":\"Kui Song, Weiguan Zhang, Wei Xu, Yi-Kuen Lee\",\"doi\":\"10.1109/NEMS.2016.7758228\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We conduct a systematic scaling analysis of the sensitivity of a silicon capacitive MEMS microphone based on a dimensionless 1-degree-of-freedom (1DOF) model considering residual stress. The theoretical normalized sensitivity we derived is a nonlinear function of normalized diaphragm size (h/a), acoustic driving frequency, 3 effective stiffness terms and the other parameters. From our 1DOF model, the optimal normalized diaphragm has to be trade-off between high sensitivity and large bandwidth. In addition, we found that a critical diaphragm radius of 415 μm for a silicon MEMS microphone, is located at the inflection point in the sensitivity function of the radius. In addition, this critical radius corresponds to the minimum effective stiffness of the microphone.\",\"PeriodicalId\":150449,\"journal\":{\"name\":\"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NEMS.2016.7758228\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2016.7758228","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scaling analysis of capacitive MEMS microphones considering residual stress
We conduct a systematic scaling analysis of the sensitivity of a silicon capacitive MEMS microphone based on a dimensionless 1-degree-of-freedom (1DOF) model considering residual stress. The theoretical normalized sensitivity we derived is a nonlinear function of normalized diaphragm size (h/a), acoustic driving frequency, 3 effective stiffness terms and the other parameters. From our 1DOF model, the optimal normalized diaphragm has to be trade-off between high sensitivity and large bandwidth. In addition, we found that a critical diaphragm radius of 415 μm for a silicon MEMS microphone, is located at the inflection point in the sensitivity function of the radius. In addition, this critical radius corresponds to the minimum effective stiffness of the microphone.