P. Hoffman, D. Liang, D. Mahulikar, A. Parthasarathi
{"title":"高性能TQFP封装的开发","authors":"P. Hoffman, D. Liang, D. Mahulikar, A. Parthasarathi","doi":"10.1109/ECTC.1994.367651","DOIUrl":null,"url":null,"abstract":"A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olin's MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Development of a high performance TQFP package\",\"authors\":\"P. Hoffman, D. Liang, D. Mahulikar, A. Parthasarathi\",\"doi\":\"10.1109/ECTC.1994.367651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olin's MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olin's MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package.<>
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