重新定义Mcm应用程序的经济性

D. Cokely, C. Strittmatter
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引用次数: 2

摘要

决定将mcm设计和集成到产品中的经济学通常仅限于对相关材料成本的比较。在许多情况下,MCM的材料成本超过了它可能取代的分立电路和集成电路。这种狭隘的焦点导致了MCM技术爆炸的扼杀。公平的比较必须通过全流程系统分析进行,并考虑到功能增强、总体产量、劳动力、负荷和对最终产品的保修影响。微互连技术是传统mcm的扩展,集成功能可以提高空间和性能。然而,当集成电路翻转到包含有源和无源器件的硅衬底时,元件数量显着减少,关键系统性能指标进一步提高。在at&t什里夫波特,小型商业电话系统的生产是为了与世界市场上的其他“商品”供应商竞争。在这种高容量环境中取得成功需要积极的成本管理和达到与消费者期望一致的可靠性水平。合作伙伴/供应商/产品管理团队将在1994年下半年率先集成倒装芯片、硅对硅、MicroInterconnect MCM技术。随着微互联技术的引入,成本将不断降低,这将对系统成本和性能产生积极影响。
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Redefining the Economics of Mcm Applications
The economics governing the decision to design and integrate MCMs into products is often limited to comparison of the associated material costs. In many cases, MCM material costs exceed that of the discretes and integrated circuits which it could potentially replace. Such narrow focus has contributed to a stifling of the MCM technology explosion. Equitable comparisons must be made through a full stream system analysis with consideration given to feature enhancement, overall yield, labor, load and warranty impacts on the end product. MicroInterconnect Technology is an extension of traditional MCMs in that integration of functions can result in space and performance improvements. However, when ICs are flipped to a silicon substrate containing active and passive devices, component count decreases significantly and the critical system performance metrics, are further improved. At AT&T-Shreveport, small business telephone systems are manufactured to compete with other "commodity" vendors in the world market. Success in this high volume environment requires aggressive cost management and achievement of reliability levels consistent with consumer expectations. The Partner/sup R/ Product Management Team will be the first to integrate flip-chip, silicon-on-silicon, MicroInterconnect MCM technology by 2Q94. Successive cost reductions will be enabled with the introduction of MicroInterconnect Technology which positively affect system cost and performance.
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