C. Comeaga, G. Ionascu, E. Manea, A. Sandu, L. Bogatu, D. Besnea
{"title":"工艺参数对MEMS加速度计动态性能的影响","authors":"C. Comeaga, G. Ionascu, E. Manea, A. Sandu, L. Bogatu, D. Besnea","doi":"10.1109/SMICND.2010.5650639","DOIUrl":null,"url":null,"abstract":"The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresistive accelerometer by using FEM (Finite Element Method). The vibration modes (resonant frequencies) and sensitivity were predicted. The results of numerical simulation, validated experimentally have pointed out the influence of manufacturing process parameters on the accelerometer performance.","PeriodicalId":377326,"journal":{"name":"CAS 2010 Proceedings (International Semiconductor Conference)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Influence of technological parameters on the dynamic behavior of a MEMS accelerometer\",\"authors\":\"C. Comeaga, G. Ionascu, E. Manea, A. Sandu, L. Bogatu, D. Besnea\",\"doi\":\"10.1109/SMICND.2010.5650639\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresistive accelerometer by using FEM (Finite Element Method). The vibration modes (resonant frequencies) and sensitivity were predicted. The results of numerical simulation, validated experimentally have pointed out the influence of manufacturing process parameters on the accelerometer performance.\",\"PeriodicalId\":377326,\"journal\":{\"name\":\"CAS 2010 Proceedings (International Semiconductor Conference)\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"CAS 2010 Proceedings (International Semiconductor Conference)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2010.5650639\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"CAS 2010 Proceedings (International Semiconductor Conference)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2010.5650639","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of technological parameters on the dynamic behavior of a MEMS accelerometer
The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresistive accelerometer by using FEM (Finite Element Method). The vibration modes (resonant frequencies) and sensitivity were predicted. The results of numerical simulation, validated experimentally have pointed out the influence of manufacturing process parameters on the accelerometer performance.