{"title":"在焊料回流过程中，塑料封装表面贴装组件的湿致封装开裂","authors":"R. Lin, E. Blackshear, P. Serisky","doi":"10.1109/RELPHY.1988.23431","DOIUrl":null,"url":null,"abstract":"The process compatibility and potential component reliability problems associated with surface-mount technology are investigated. Major reliability concerns observed during qualification of vendors' surface mount ICs are reported. Moisture-induced package cracking and its implication for the corrosion resistance of the package are discussed. The application of acoustic microscopy techniques such as scanning laser acoustic microscopy (SLAM) and C-mode scanning acoustic microscopy (C-SAM) for examining internal package cracking is described. The concept of threshold (safe) moisture level in a surface-mount package and the proper procedures for determining it are discussed.<<ETX>>","PeriodicalId":102187,"journal":{"name":"26th Annual Proceedings Reliability Physics Symposium 1988","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"82","resultStr":"{\"title\":\"Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process\",\"authors\":\"R. Lin, E. Blackshear, P. Serisky\",\"doi\":\"10.1109/RELPHY.1988.23431\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The process compatibility and potential component reliability problems associated with surface-mount technology are investigated. Major reliability concerns observed during qualification of vendors' surface mount ICs are reported. Moisture-induced package cracking and its implication for the corrosion resistance of the package are discussed. The application of acoustic microscopy techniques such as scanning laser acoustic microscopy (SLAM) and C-mode scanning acoustic microscopy (C-SAM) for examining internal package cracking is described. The concept of threshold (safe) moisture level in a surface-mount package and the proper procedures for determining it are discussed.<<ETX>>\",\"PeriodicalId\":102187,\"journal\":{\"name\":\"26th Annual Proceedings Reliability Physics Symposium 1988\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"82\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"26th Annual Proceedings Reliability Physics Symposium 1988\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1988.23431\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"26th Annual Proceedings Reliability Physics Symposium 1988","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1988.23431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process
The process compatibility and potential component reliability problems associated with surface-mount technology are investigated. Major reliability concerns observed during qualification of vendors' surface mount ICs are reported. Moisture-induced package cracking and its implication for the corrosion resistance of the package are discussed. The application of acoustic microscopy techniques such as scanning laser acoustic microscopy (SLAM) and C-mode scanning acoustic microscopy (C-SAM) for examining internal package cracking is described. The concept of threshold (safe) moisture level in a surface-mount package and the proper procedures for determining it are discussed.<>
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