嵌入式精细互连的异构集成

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) Pub Date : 2021-06-01 DOI:10.1109/ECTC32696.2021.00348

C. T. Chong, Lim Teck Guan, D. Ho, Han Yong, C. Choong, Sharon Lim Pei Siang, S. Bhattacharya

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引用次数: 3

摘要

采用RDL第1扇出晶圆封装平台，通过采用嵌入式细间距互连(EFI)在面对面配置中实现ASIC和HBM2的高密度异构集成。将讨论EFI配置、高功率应用的热设计考虑和散热、翘曲控制的机械结构建模、晶圆制造和组装过程集成以及可靠性测试结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Heterogeneous Integration with Embedded Fine Interconnect

High density heterogeneous integration of ASIC and HBM2 through the use of embedded fine pitch interconnect (EFI) in face-to-face configuration using RDL 1st fan-out wafer packaging platform is demonstrated. The EFI configuration, thermal design consideration and heat dissipation for high power application, mechanical structural modeling for warpage control, wafer fabrication and assembly process integration and reliability testing results will be discussed.

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2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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