F. Garbuglia, D. Spina, Torsten Reuschel, C. Schuster, D. Deschrijver, T. Dhaene
{"title":"基于周期高斯过程核的互连s参数建模","authors":"F. Garbuglia, D. Spina, Torsten Reuschel, C. Schuster, D. Deschrijver, T. Dhaene","doi":"10.1109/SPI57109.2023.10145548","DOIUrl":null,"url":null,"abstract":"In this paper, we present a novel technique to model wide-band scattering parameter (S-parameter) curves of high-speed digital interconnects. The proposed technique utilizes a new kernel function with periodic components for Gaussian process (GP) models. After proper training, the GP models are able to predict the S-parameter values at arbitrary frequency points inside the trained interval. The performance of the proposed technique is reviewed by means of correlation with standard Gaussian Processes with squared exponential kernel and Matern kernel. Results for the proposed technique show an increased prediction accuracy when applied to interconnects.","PeriodicalId":281134,"journal":{"name":"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels\",\"authors\":\"F. Garbuglia, D. Spina, Torsten Reuschel, C. Schuster, D. Deschrijver, T. Dhaene\",\"doi\":\"10.1109/SPI57109.2023.10145548\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a novel technique to model wide-band scattering parameter (S-parameter) curves of high-speed digital interconnects. The proposed technique utilizes a new kernel function with periodic components for Gaussian process (GP) models. After proper training, the GP models are able to predict the S-parameter values at arbitrary frequency points inside the trained interval. The performance of the proposed technique is reviewed by means of correlation with standard Gaussian Processes with squared exponential kernel and Matern kernel. Results for the proposed technique show an increased prediction accuracy when applied to interconnects.\",\"PeriodicalId\":281134,\"journal\":{\"name\":\"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI57109.2023.10145548\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI57109.2023.10145548","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels
In this paper, we present a novel technique to model wide-band scattering parameter (S-parameter) curves of high-speed digital interconnects. The proposed technique utilizes a new kernel function with periodic components for Gaussian process (GP) models. After proper training, the GP models are able to predict the S-parameter values at arbitrary frequency points inside the trained interval. The performance of the proposed technique is reviewed by means of correlation with standard Gaussian Processes with squared exponential kernel and Matern kernel. Results for the proposed technique show an increased prediction accuracy when applied to interconnects.