{"title":"利用一种新颖的倒装芯片键合、SOI上反射镜有源干对准方法的优势,在硅光子集成电路(PICs)上开发vcsel的晶圆级封装(会议报告)","authors":"G. Delrosso","doi":"10.1117/12.2633800","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":210979,"journal":{"name":"Optical System Alignment, Tolerancing, and Verification XIV","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Exploiting wafer level packaging of VCSELs on silicon photonic integrated circuits (PICs) with the advantages of a novel, flip-chip bonding, active dry-alignments method on SOI up-reflecting mirrors (Conference Presentation)\",\"authors\":\"G. Delrosso\",\"doi\":\"10.1117/12.2633800\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":210979,\"journal\":{\"name\":\"Optical System Alignment, Tolerancing, and Verification XIV\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optical System Alignment, Tolerancing, and Verification XIV\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2633800\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical System Alignment, Tolerancing, and Verification XIV","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2633800","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Exploiting wafer level packaging of VCSELs on silicon photonic integrated circuits (PICs) with the advantages of a novel, flip-chip bonding, active dry-alignments method on SOI up-reflecting mirrors (Conference Presentation)