{"title":"Exploiting wafer level packaging of VCSELs on silicon photonic integrated circuits (PICs) with the advantages of a novel, flip-chip bonding, active dry-alignments method on SOI up-reflecting mirrors (Conference Presentation)","authors":"G. Delrosso","doi":"10.1117/12.2633800","DOIUrl":"https://doi.org/10.1117/12.2633800","url":null,"abstract":"","PeriodicalId":210979,"journal":{"name":"Optical System Alignment, Tolerancing, and Verification XIV","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122811400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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