{"title":"研发半导体晶圆制造的周期时间指标","authors":"N. Pierce, A. Yost","doi":"10.1109/ASMC.1995.484350","DOIUrl":null,"url":null,"abstract":"This paper presents a case study for the successful development and effective use of cycle time metrics for fabricating semiconductor wafers in a research and development (R&D) environment. The metrics include multiples of theoretical cycle time (MTCT), breakdown analysis of cycle time, and cumulative queue times of baseline processes. Each of these metrics was applied to equipment types, process recipes, and overall pilot line performance as well as to production areas such as Films, Implant, and Etch.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Cycle time metrics for R&D semiconductor wafer fabrication\",\"authors\":\"N. Pierce, A. Yost\",\"doi\":\"10.1109/ASMC.1995.484350\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a case study for the successful development and effective use of cycle time metrics for fabricating semiconductor wafers in a research and development (R&D) environment. The metrics include multiples of theoretical cycle time (MTCT), breakdown analysis of cycle time, and cumulative queue times of baseline processes. Each of these metrics was applied to equipment types, process recipes, and overall pilot line performance as well as to production areas such as Films, Implant, and Etch.\",\"PeriodicalId\":237741,\"journal\":{\"name\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1995.484350\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1995.484350","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Cycle time metrics for R&D semiconductor wafer fabrication
This paper presents a case study for the successful development and effective use of cycle time metrics for fabricating semiconductor wafers in a research and development (R&D) environment. The metrics include multiples of theoretical cycle time (MTCT), breakdown analysis of cycle time, and cumulative queue times of baseline processes. Each of these metrics was applied to equipment types, process recipes, and overall pilot line performance as well as to production areas such as Films, Implant, and Etch.