厚光刻胶三维光刻制备电镀三维微线圈的新方法

Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) Pub Date : 1998-07-13 DOI:10.1109/IMNC.1998.729981

J.-B. Yoon, Chul‐Hi Han, E. Yoon, C. kim

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摘要

我们采用了一种新颖的、高产率的工艺来制作电镀三维微线圈的概念，如图1所示，我们将集成电感的三维微线圈分解为底部导体桥架两部分，并在其中形成单体空气桥架，这并不意味着空气桥架是用传统的方式制作的，f柱(或过孔)和上导体线垂直，因此是a

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Novel Fabrication Of Electroplated 3D Micro-Coils Using 3D Photolithography Of Thick Photoresist

ed a novel and high-yield process to fabricate electroplated 3D microI concept as shown in Figure 1, we decompose the 3D micro-coil, which integrated inductor in other words, into two parts, the bottom conductor bridges, and form the single-body air bridges during only one his does not mean the air bridges are made by the conventional way, f posts (or vias) and upper conductor lines vertically, and hence is a

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Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)

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