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引用次数: 18

摘要

放置是IC物理设计的核心:它决定了空间嵌入,从而决定了寄生和性能。从粗颗粒到细颗粒,布局与逻辑、性能、时钟和电源分布、可路由性和可制造性共同优化。本文对集成电路物理设计中贴片研究的未来提出了一些个人的看法。作为优化重新访问放置会促使您重新审视放置需求、优化质量和资源可伸缩性。放置也必须不断发展,以满足共同优化和与其他设计步骤合作的日益增长的需求。无论是在2D缩放路线图的末端,还是在未来2.5D/3D/4D集成的背景下,缩放自然会带来“新的”挑战。而且,机器学习和布局优化的关系将继续成为研究和实践的重点领域。总的来说,安置研究可能会看到更多的流量规模的优化环境,开源,对最优性进展的基准测试,以及对转化为现实世界实践的关注。
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Advancing Placement
Placement is central to IC physical design: it determines spatial embedding, and hence parasitics and performance. From coarse-to fine-grain, placement is conjointly optimized with logic, performance, clock and power distribution, routability and manufacturability. This paper gives some personal thoughts on futures for placement research in IC physical design. Revisiting placement as optimization prompts a new look at placement requirements, optimization quality, and scalability with resources. Placement must also evolve to meet a growing need for co-optimizations and for co-operation with other design steps. "New" challenges will naturally arise from scaling, both at the end of the 2D scaling roadmap and in the context of future 2.5D/3D/4D integrations. And, the nexus of machine learning and placement optimization will continue to be an area of intense focus for research and practice. In general, placement research is likely to see more flow-scale optimization contexts, open source, benchmarking of progress toward optimality, and attention to translations into real-world practice.
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