用于MONOS存储器制造的SixNy反应溅射

M. Adam, A. Coelho, M. Pereira, H. Boudinov
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摘要

研究了反应溅射沉积六层镍在MONOS存储器制造中的应用。通过椭偏光谱测量、I-V测量和MEIS对氮化硅薄膜的光学、电学和组成性能进行了研究。描述了两种不同沉积机制的薄膜:缺乏硅的样品A和硅过量的样品B。MEIS得到的组成结果表明,样品A的Si2.6N4和样品B的Si3.3N4的化学计量值与样品A相比,样品B中的硅过量导致电阻膜更小,使用两种沉积制度制备了两种存储器件进行比较。我们进行了保留和持久度测量,观察到存储器B的程序/擦除窗口为10 V,大约是存储器a的3倍。持久度测量显示,存储器B在10,000个周期后具有非零窗口,而存储器a在200个周期后几乎为零窗口。这些结果表明,使用富硅溅射的SixNy层可以改善存储特性。
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Reactive sputtering of SixNy for MONOS memory fabrication
Reactive sputtering deposition of SixNy layers for application in MONOS memory fabrication was studied. The optical, electrical and compositional properties of these silicon nitride films were investigated by spectral ellipsometry measurements, I-V measurements and MEIS. Two films with different deposition regimes are described: sample A with a lack of silicon, and sample B with an excess of silicon. The compositional results obtained by MEIS showed the stoichiometry of Si2.6N4 for sample A and Si3.3N4 for sample B. Silicon excess in sample B results in a less resistive film as compared to sample A. Two memory devices have been fabricated for comparison, using both deposition regimes. Retention and endurance measurements have been performed and it was observed that memory B has a Program/Erase window of 10 V, approximately 3 times larger than that of memory A. Endurance measurements revealed that memory B has non-zero window after 10 000 cycles, while memory A window is practically zero after 200 cycles. These results point to an improvement of memory characteristics with the use of silicon rich sputtered SixNy layers.
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