用封装键合线电感补偿大于Gbps差分SerDes器件的ESD和输入电容效应

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250022

Seungyoung Ahn, Jongbae Park, Daehyun Chung, Joungho Kim

{"title":"用封装键合线电感补偿大于Gbps差分SerDes器件的ESD和输入电容效应","authors":"Seungyoung Ahn, Jongbae Park, Daehyun Chung, Joungho Kim","doi":"10.1109/EPEP.2003.1250022","DOIUrl":null,"url":null,"abstract":"We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"117 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices\",\"authors\":\"Seungyoung Ahn, Jongbae Park, Daehyun Chung, Joungho Kim\",\"doi\":\"10.1109/EPEP.2003.1250022\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"117 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250022\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

本文首先介绍了利用封装键合线电感补偿集成电路输入电容效应的方法。通过对这种效应的分析，我们提出了寻找最佳电感的方法，并通过仿真和测量证明了该方法对时域性能的改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices

We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

自引率

0.00%

发文量

期刊最新文献

Modeling of non-ideal planes in stripline structures Generation of passive macromodels from transient port responses Power distribution analysis methodology for a multi-gigabit I/O interface Enforcing passivity for rational function based macromodels of tabulated data Laminate package trends for high-speed system interconnects