三维封装中感应耦合无线连接分析

2013 IEEE 10th International Conference on ASIC Pub Date : 2013-10-01 DOI:10.1109/ASICON.2013.6811861

B. Wang, Guoyi Yu, Xiaofei Chen, Li Zhang, Xavier Zou

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摘要

本文提出了一种高精度的三维物理模型和Greenhouse算法。本文提出了一种相对简单、快速的耦合电感系数计算方法。讨论了电感耦合效率高的参数。计算出三维封装中电感通道干扰最小的合适位置。

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Analysis inductively coupling wireless connection in 3D package

A accuracy physical model and Greenhouse algorithm is presented in this paper in 3D package. A relative simple and fast method of calculation the coupling inductors coefficient is presented in this paper. The parameters of the inductors coupling is high efficiency are discussed. The appropriate position is calculated where the interference of inductor channel is minimum in the 3D package.

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2013 IEEE 10th International Conference on ASIC

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