Masaharu Furuyama, Hideaki Nagaoka, T. Akahoshi, D. Mizutani, S. Sakuyama, M. Nagatake, Nobutaka Itoh
{"title":"基板制造过程中基于树脂固化行为的翘曲预测仿真方法","authors":"Masaharu Furuyama, Hideaki Nagaoka, T. Akahoshi, D. Mizutani, S. Sakuyama, M. Nagatake, Nobutaka Itoh","doi":"10.1109/EPTC.2018.8654387","DOIUrl":null,"url":null,"abstract":"Progress in the high-density mounting of electronic equipment warrants a manufacturing technique for suppressing the warpage of the circuit board and an analysis technique for predicting warpage. In this study, we developed a technique to accurately predict the difference in circuit board warpage caused by variations in manufacturing process by simulating resin curing behavior. As a result, the manufacturing process was optimized to reduce mounting failure caused by substrate warpage.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"600 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process\",\"authors\":\"Masaharu Furuyama, Hideaki Nagaoka, T. Akahoshi, D. Mizutani, S. Sakuyama, M. Nagatake, Nobutaka Itoh\",\"doi\":\"10.1109/EPTC.2018.8654387\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Progress in the high-density mounting of electronic equipment warrants a manufacturing technique for suppressing the warpage of the circuit board and an analysis technique for predicting warpage. In this study, we developed a technique to accurately predict the difference in circuit board warpage caused by variations in manufacturing process by simulating resin curing behavior. As a result, the manufacturing process was optimized to reduce mounting failure caused by substrate warpage.\",\"PeriodicalId\":360239,\"journal\":{\"name\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"600 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2018.8654387\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654387","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process
Progress in the high-density mounting of electronic equipment warrants a manufacturing technique for suppressing the warpage of the circuit board and an analysis technique for predicting warpage. In this study, we developed a technique to accurately predict the difference in circuit board warpage caused by variations in manufacturing process by simulating resin curing behavior. As a result, the manufacturing process was optimized to reduce mounting failure caused by substrate warpage.
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