J. C. Howes, D. Levett, S. T. Wilson, J. Marsala, D. Saums
{"title":"可蒸发介质(VDF)对IGBT驱动系统的冷却","authors":"J. C. Howes, D. Levett, S. T. Wilson, J. Marsala, D. Saums","doi":"10.1109/STHERM.2008.4509358","DOIUrl":null,"url":null,"abstract":"The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a single-cabinet 750 kW, 1,000-horsepower drive system utilizing low-flow, pumped liquid multiphase cooling. Positive and negative attributes of each thermal solution are described.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)\",\"authors\":\"J. C. Howes, D. Levett, S. T. Wilson, J. Marsala, D. Saums\",\"doi\":\"10.1109/STHERM.2008.4509358\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a single-cabinet 750 kW, 1,000-horsepower drive system utilizing low-flow, pumped liquid multiphase cooling. Positive and negative attributes of each thermal solution are described.\",\"PeriodicalId\":285718,\"journal\":{\"name\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2008.4509358\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2008.4509358","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 25
摘要
提出了一种可蒸发的介电流体的使用，并在使用中程1200 VAC 450 a IGBT设备的概念验证电驱动系统中进行了演示。对比经验数据显示了采用传统风冷挤压铝散热器散热解决方案的驱动系统，与几种水冷液体冷板解决方案和采用低流量泵送液体多相冷却的单机柜750千瓦，1000马力驱动系统的驱动系统。描述了每种热溶液的正、负属性。
Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)
The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a single-cabinet 750 kW, 1,000-horsepower drive system utilizing low-flow, pumped liquid multiphase cooling. Positive and negative attributes of each thermal solution are described.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
