K. Weide-Zaage, A. Moujbani, G. Duchamp, T. Dubois, F. Verdier, H. Frémont
{"title":"SI/EMC和可靠性问题如何在嵌入式电子系统中相互作用?","authors":"K. Weide-Zaage, A. Moujbani, G. Duchamp, T. Dubois, F. Verdier, H. Frémont","doi":"10.1109/ISEMC.2015.7256363","DOIUrl":null,"url":null,"abstract":"The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"How SI/EMC and reliability issues could interact together in embedded electronic systems?\",\"authors\":\"K. Weide-Zaage, A. Moujbani, G. Duchamp, T. Dubois, F. Verdier, H. Frémont\",\"doi\":\"10.1109/ISEMC.2015.7256363\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.\",\"PeriodicalId\":412708,\"journal\":{\"name\":\"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2015.7256363\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2015.7256363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
How SI/EMC and reliability issues could interact together in embedded electronic systems?
The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.