用于高性能非晶In-Ga-Zn-O薄膜晶体管的低温高k溶液处理混合栅极绝缘体

Ployrung Kesorn, J. Bermundo, Naofumi Yoshida, T. Nonaka, M. Fujii, Y. Ishikawa, Y. Uraoka
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引用次数: 1

摘要

在塑料衬底上制造高性能非晶In-Ga-Zn-O (a-IGZO)薄膜晶体管(TFTs)用于柔性显示应用,需要低温工艺。此外,高k材料在促进小型化的同时具有更高的迁移率、更高的漏极电流和更低的阈值电压,有望取代传统的SiO2栅极绝缘子。因此,采用含高k BaTiO3纳米粒子和透明聚硅氧烷(Poly-SX)的杂化材料作为a-IGZO TFTs的栅极绝缘体。选择混合材料而不仅仅是BaTiO3薄膜可以降低工艺温度。本文研究了在较低温度(300℃)下沉积不同BaTiO3/Poly-SX比率的溶液处理混合栅绝缘子的a- igzo TFTs的性能。该器件具有30.17 cm2/Vs的高迁移率、0.4 V的低阈值电压和~10−8 a /cm2的漏电流密度。
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Low Temperature High-k Solution Processed Hybrid Gate Insulator for High Performance Amorphous In-Ga-Zn-O Thin-Film Transistors
Low temperature process is required to fabricate high performance amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs) on plastic substrates for flexible display applications. In addition, high-k material which allows higher mobility, higher drain current and lower threshold voltage while facilitating miniaturization, is poised to replace conventional SiO2 gate insulators in TFTs. Therefore, hybrid material containing high-k BaTiO3 nanoparticles and transparent Poly-siloxane (Poly-SX) were used as gate insulator in a-IGZO TFTs. Opting for a hybrid material instead of only a BaTiO3 film enables lowering of process temperatures. This paper presents the performance of a-IGZO TFTs with solution processed hybrid gate insulators at different BaTiO3/Poly-SX ratios deposited at a lower temperature (300°C). The device shows a high mobility of 30.17 cm2/Vs, low threshold voltage of 0.4 V, and leakage current density of ~10−8 A/cm2.
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