TECHNIQUE FOR OPERATIONAL CONTROL OF THE DEGREE OF CONTAMINATION OF MICROELECTRONICS SUBSTRATES WITH ORGANIC CONTAMINANTS

A technique for ope rational control of the degree of contamination of microelectronic substrates with organic impurities is presented by the wetting angle of a controlled substrate by a drop of liquid. The technique consists in forming a drop of distilled water on the surface of the substrate under study, photographing the drop and using the resulting image, determining the relative roughness and degree of contamination of the substrate with organic impurities. The operability of the technique has been experimentally proved using the example of substrates made of glass, glass-ceramic and silicon. The deviation of measurements of substrate contamination measured by the proposed method relative to the data obtained by atomic force microscopy does not exceed 3 %. The technique allows, while increasing the accuracy of measuring the degree of contamination, to reduce the time of this control, while ensuring the safety of the controlled substrates. At the same time, to reduce the time of using specialized equipment for the purpose of monitoring the degree of contamination of the substrates.