薄膜气体传感器微热板的设计与制造

S. Fung, P. Chan, J. Sin, P. Cheung
{"title":"薄膜气体传感器微热板的设计与制造","authors":"S. Fung, P. Chan, J. Sin, P. Cheung","doi":"10.1109/HKEDM.1994.395133","DOIUrl":null,"url":null,"abstract":"This paper reports a novel approach to fabricate a micro-hotplate for a thin film gas sensor. The approach uses frontside anisotropic etching of silicon together with special layout to create the thermally isolated structure. A sandwich of inter-dielectric layers and aluminum interconnection provides the supporting material while highly doped boron diffusion provides the heating and temperature sensing elements. The design incorporates a guard heater layout that improves the temperature uniformity. Simulation results show that the temperature variation on a sensor film of 50/spl times/60 /spl mu/m/sup 2/ is less than 25/spl deg/C when the operating temperature is 350/spl deg/C. The micro-hotplate exhibits heating efficiency of about 7/spl deg/C/mW and is compatible with standard technology.<<ETX>>","PeriodicalId":206109,"journal":{"name":"1994 IEEE Hong Kong Electron Devices Meeting","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design and fabrication of micro-hotplate for thin film gas sensor\",\"authors\":\"S. Fung, P. Chan, J. Sin, P. Cheung\",\"doi\":\"10.1109/HKEDM.1994.395133\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports a novel approach to fabricate a micro-hotplate for a thin film gas sensor. The approach uses frontside anisotropic etching of silicon together with special layout to create the thermally isolated structure. A sandwich of inter-dielectric layers and aluminum interconnection provides the supporting material while highly doped boron diffusion provides the heating and temperature sensing elements. The design incorporates a guard heater layout that improves the temperature uniformity. Simulation results show that the temperature variation on a sensor film of 50/spl times/60 /spl mu/m/sup 2/ is less than 25/spl deg/C when the operating temperature is 350/spl deg/C. The micro-hotplate exhibits heating efficiency of about 7/spl deg/C/mW and is compatible with standard technology.<<ETX>>\",\"PeriodicalId\":206109,\"journal\":{\"name\":\"1994 IEEE Hong Kong Electron Devices Meeting\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 IEEE Hong Kong Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HKEDM.1994.395133\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 IEEE Hong Kong Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HKEDM.1994.395133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文报道了一种制作薄膜气体传感器微热板的新方法。该方法利用硅的正面各向异性蚀刻以及特殊的布局来创建热隔离结构。中间介电层和铝互连的夹层提供支撑材料,而高掺杂硼扩散提供加热和温度传感元件。该设计包括一个保护加热器布局,提高温度均匀性。仿真结果表明,当工作温度为350/spl℃时,50/spl次/60 /spl μ /m/sup 2/的传感器膜上的温度变化小于25/spl℃。微热板的加热效率约为7/spl度/C/mW,并与标准技术兼容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Design and fabrication of micro-hotplate for thin film gas sensor
This paper reports a novel approach to fabricate a micro-hotplate for a thin film gas sensor. The approach uses frontside anisotropic etching of silicon together with special layout to create the thermally isolated structure. A sandwich of inter-dielectric layers and aluminum interconnection provides the supporting material while highly doped boron diffusion provides the heating and temperature sensing elements. The design incorporates a guard heater layout that improves the temperature uniformity. Simulation results show that the temperature variation on a sensor film of 50/spl times/60 /spl mu/m/sup 2/ is less than 25/spl deg/C when the operating temperature is 350/spl deg/C. The micro-hotplate exhibits heating efficiency of about 7/spl deg/C/mW and is compatible with standard technology.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A process scheme chosen for BiCMOS circuit Calculation of I-V curves of a GaAs MESFET with nonuniform channel doping by means of numerical integration Electrical performance and reliability of n-MOSFET's with gate dielectrics fabricated by different techniques Design and fabrication of micro-hotplate for thin film gas sensor A methodology for converting polygon based standard cell from bulk CMOS to SOI
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1