错位对Cu-Cu杂化键合强度的影响

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598381

Shunsuke Furuse, N. Fujii, Kengo Kotoo, Naoki Ogawa, Taichi Yamada, T. Hirano, S. Saito, Y. Hagimoto, H. Iwamoto

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引用次数: 0

摘要

在本研究中，我们研究了Cu-Cu杂化键合过程中退火前后的不对准与键合强度的关系。在退火处理前，随着取向偏差的增加，结合强度呈线性降低的趋势。然而，我们发现这种相关性在退火后发生了变化，似乎是由于Cu中的热膨胀。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impacts of Misalignment on Bonding Strength of Cu-Cu Hybrid Bonding

In this study, we investigated the relationship between misalignment and bonding strength before and after annealing in the Cu-Cu hybrid bonding process. Before the annealing process, the bonding strength tended to decrease linearly as the misalignment increased. However, we found that this correlation changed after the annealing, seemingly due to thermal expansion in the Cu.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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