现代多核处理器中核交换的有效性分析

P. Zając, M. Szermer, M. Janicki, C. Maj, P. Pietrzak, A. Napieralski
{"title":"现代多核处理器中核交换的有效性分析","authors":"P. Zając, M. Szermer, M. Janicki, C. Maj, P. Pietrzak, A. Napieralski","doi":"10.1109/THERMINIC.2013.6675178","DOIUrl":null,"url":null,"abstract":"One of the interesting thermal management techniques for multi-core processors is core swapping. In this paper, using the published power data and floorplans for two modern high-performance processors, we employ the well-known HotSpot tool to perform the thermal simulation of the core swapping mechanism. Our transient simulations show that by using core swapping technique, it was possible to either minimize the hot spot temperature in the Ivy Bridge chip by 5°C or increase the operating frequency by 17% and maintain the same temperature as in the case without core swapping. We also derive an analytical model of the activity migration mechanism between two cores which may serve as a tool to calculate the swapping frequency given the desired maximal temperature drop. The model also allows for the correlation of the cooling effectiveness with the performance penalty induced by the swapping.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"264 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Analysis of the effectiveness of core swapping in modern multicore processors\",\"authors\":\"P. Zając, M. Szermer, M. Janicki, C. Maj, P. Pietrzak, A. Napieralski\",\"doi\":\"10.1109/THERMINIC.2013.6675178\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the interesting thermal management techniques for multi-core processors is core swapping. In this paper, using the published power data and floorplans for two modern high-performance processors, we employ the well-known HotSpot tool to perform the thermal simulation of the core swapping mechanism. Our transient simulations show that by using core swapping technique, it was possible to either minimize the hot spot temperature in the Ivy Bridge chip by 5°C or increase the operating frequency by 17% and maintain the same temperature as in the case without core swapping. We also derive an analytical model of the activity migration mechanism between two cores which may serve as a tool to calculate the swapping frequency given the desired maximal temperature drop. The model also allows for the correlation of the cooling effectiveness with the performance penalty induced by the swapping.\",\"PeriodicalId\":369128,\"journal\":{\"name\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"264 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2013.6675178\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2013.6675178","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

多核处理器的一个有趣的热管理技术是核交换。在本文中,我们利用两个现代高性能处理器的公开功耗数据和布局图,使用著名的HotSpot工具对核心交换机制进行热模拟。我们的瞬态模拟表明,通过使用核心交换技术,可以将Ivy Bridge芯片的热点温度降低5°C,或者将工作频率提高17%,并保持与不使用核心交换的情况相同的温度。我们还推导了两个核心之间的活动迁移机制的分析模型,该模型可以作为计算给定所需最大温度降的交换频率的工具。该模型还考虑了冷却效率与交换引起的性能损失之间的相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Analysis of the effectiveness of core swapping in modern multicore processors
One of the interesting thermal management techniques for multi-core processors is core swapping. In this paper, using the published power data and floorplans for two modern high-performance processors, we employ the well-known HotSpot tool to perform the thermal simulation of the core swapping mechanism. Our transient simulations show that by using core swapping technique, it was possible to either minimize the hot spot temperature in the Ivy Bridge chip by 5°C or increase the operating frequency by 17% and maintain the same temperature as in the case without core swapping. We also derive an analytical model of the activity migration mechanism between two cores which may serve as a tool to calculate the swapping frequency given the desired maximal temperature drop. The model also allows for the correlation of the cooling effectiveness with the performance penalty induced by the swapping.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization Novel approach to compact modeling for nonlinear thermal conduction problems Thermal model generalization of infrared radiation sensors Controlling the density of CNTs by different underlayer materials in PECVD growth Thermal design of a high current circuit board for automotive applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1