随机退化和分布缺陷浓度的危险功能含义

J. A. Nachlas, C. Cassady, K.F. Rooney
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引用次数: 0

摘要

提出了集成电路(IC)器件群中初始缺陷浓度与相关寿命分布之间关系的两个候选模型。其中一个模型是专门基于晶圆几何形状的,而另一个模型则将随机劣化描述为降解反应产物的积累。这两种模型都经过计算机模拟,以确定其中一种是否表现出与经验经验一致的行为。不幸的是,虽然两种模型都表现出一些合理的行为,但都不能充分地描述集成电路失效与初始缺陷的关系。
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Hazard-function implications of stochastic-deterioration and distributed-defect concentrations
Two candidate models of the relationship between the initial defect concentration in a population of integrated circuit (IC) devices and the associated life distribution are presented. One of the models is based specifically upon wafer geometry while the other portrays stochastic deterioration as the the accumulation of degradation reaction product. The two models are subjected to computer simulation in order to determine if either displays behavior that is consistent with empirical experience. Unfortunately, while both models display some reasonable behavior, neither may be said to provide an adequate general description of IC failure dependence upon initial defects.
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