在此基础上形成了MBE在Si和P + / n结上生长的HgCdTe层的电学性能

A. Guzev, A. P. Kovchavtcev, A. Tsarenko, M. Yakushev, V. Varavin, V. Vasilyev, S. Dvoretsky, D. Marin, I. Sabinina, D. Shefer, G. Sidorov, Yu. G. Sidorov
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引用次数: 2

摘要

研究了在Si(310)衬底上通过分子束外延生长的x≈0.3 - 0.4的未掺杂、掺杂铟和掺杂砷的CdXHg1-XTe层的电学性质。生长后的HgCdTe层在汞气氛下退火。在室温下,砷掺杂层的寿命与载流子浓度无关。在饱和汞蒸汽压下退火后,掺杂铟层的寿命增加。这可以用复合中心密度的抑制来解释。研究了MBE在Si衬底上生长的Cd0.3Hg0.7Te异质结构中p+-n结反向电流的温度依赖性。
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The electrical properties of HgCdTe layers grown by MBE on Si and P + / n junction formed on its basis
We studied the electrical properties of undoped and indium-doped and arsenic-doped CdXHg1-XTe layers with x ≈ 0.3 - 0.4 grown by molecular beam epitaxy on Si (310) substrates. After the growth HgCdTe layers were annealed at mercury atmosphere. The lifetime at room temperature in the As-doped layers, do not depend on its carrier concentration. The lifetime in indium-doped layers increased after annealing at saturated mercury vapor pressure. It is explained by suppression of recombination centers density. Temperature dependence of the reverse currents of p+-n junctions fabricated in Cd0.3Hg0.7Te heterostuctures grown by MBE on Si substrates has been studied.
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