电子学三维共轭传热分析

J. Fradin, L. Molla, B. Desaunettes
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引用次数: 3

摘要

提出了一种分析电子器件实际三维共轭传热的有效方法。该方法基于两个软件的耦合:基于边界元法的导电软件(REBECA-3D(R))和基于体积有限法的对流软件(FLUENT)。该方法在多芯片模块(CPGA224)上进行了测试,实验已由CNRS(法国国家科学研究中心)进行。
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Analysis of 3D conjugate heat transfers in electronics
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research).
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