{"title":"电子学三维共轭传热分析","authors":"J. Fradin, L. Molla, B. Desaunettes","doi":"10.1109/EDTC.1997.582357","DOIUrl":null,"url":null,"abstract":"An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research).","PeriodicalId":297301,"journal":{"name":"Proceedings European Design and Test Conference. ED & TC 97","volume":"87 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Analysis of 3D conjugate heat transfers in electronics\",\"authors\":\"J. Fradin, L. Molla, B. Desaunettes\",\"doi\":\"10.1109/EDTC.1997.582357\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research).\",\"PeriodicalId\":297301,\"journal\":{\"name\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"volume\":\"87 1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTC.1997.582357\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings European Design and Test Conference. ED & TC 97","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTC.1997.582357","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of 3D conjugate heat transfers in electronics
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research).
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
