1993年关于半导体热和温度测试的文章累积参考书目

B. Siegal
{"title":"1993年关于半导体热和温度测试的文章累积参考书目","authors":"B. Siegal","doi":"10.1109/STHERM.1993.225314","DOIUrl":null,"url":null,"abstract":"A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"1993 cumulative bibliography of articles on semiconductor thermal and temperature testing\",\"authors\":\"B. Siegal\",\"doi\":\"10.1109/STHERM.1993.225314\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided.<<ETX>>\",\"PeriodicalId\":369022,\"journal\":{\"name\":\"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1993.225314\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1993.225314","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

提供有关半导体热和/或温度特性、测量技术和结果、硬件应用和其他相关信息的参考书目。
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1993 cumulative bibliography of articles on semiconductor thermal and temperature testing
A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided.<>
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